This book cannot be downloaded as a file but can be read in our app or online on the website.
Volume 464 pages
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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
This book cannot be downloaded as a file but can be read in our app or online on the website.
About the book
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools